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images/news/intel.jpgThings are as hot as even on the CPU front and while AMD is announcing new tri-core CPUs set to be released in Q1 2008, Intel is already demonstrating processors that will not be seeing the light of day until the second half of next year. Yes, at the IDF show Intel president and CEO Paul Otellini has unveiled working samples of the upcoming 45nm-built Nehalem processors, in addition to showing off 32nm parts that will not enter service or production until 2009.
Talking about 45nm CPUs, Otellini has announced that Intel plans to introduce 15 new 45nm processors by the end of the year and another 20 in the first quarter of 2008. Following this massive wave, H2 2008 will see the release of the Nehalem family, the first CPUs that will use the QuickPath Interconnect system architecture which will include an integrated memory controller and improved communication links between system components
“Nehalem is an entirely new architecture that leverages Intel's Core Microarchitecture, bringing leading-edge performance advantages, power efficiency and important new server features to market just a year after Intel leads the industry to 45nm technology,” said Otellini.
As for 2009 and beyond, Intel's CEO has showed the world’s first 300mm wafer built using next-generation 32nm process technology. This comes to prove that Intel will be ready to migrate towards the new node when it initially predicted, in 2009. Those Phenom X3s don't look so hot now.
TCMag
Talking about 45nm CPUs, Otellini has announced that Intel plans to introduce 15 new 45nm processors by the end of the year and another 20 in the first quarter of 2008. Following this massive wave, H2 2008 will see the release of the Nehalem family, the first CPUs that will use the QuickPath Interconnect system architecture which will include an integrated memory controller and improved communication links between system components
“Nehalem is an entirely new architecture that leverages Intel's Core Microarchitecture, bringing leading-edge performance advantages, power efficiency and important new server features to market just a year after Intel leads the industry to 45nm technology,” said Otellini.
As for 2009 and beyond, Intel's CEO has showed the world’s first 300mm wafer built using next-generation 32nm process technology. This comes to prove that Intel will be ready to migrate towards the new node when it initially predicted, in 2009. Those Phenom X3s don't look so hot now.
TCMag
